OpenAI
is
reportedly
working
with
Broadcom
to
develop
new
custom
silicon
designed
to
handle
its
large
AI
workloads
for
inference
and
secured
manufacturing
capacity
with
TSMC,
according
to
sources
speaking
to
Reuters.
OpenAI
has
reportedly
built
a
chip
development
team
of
about
20
people,
including
lead
engineers
who
previously
worked
on
Google’s
Tensor
processors
for
AI.
Still,
on
its
current
timeline,
the
custom-designed
hardware
may
not
start
production
until
2026.
In
the
meantime,
the
sources
also
said
OpenAI
is
incorporating
AMD
chips
into
its
Microsoft
Azure
setup.
AMD
introduced
its
MI300
chips
last
year,
which
was
a
big
part
of
the
news
this
summer
that
its
data
center
business
has
doubled
in
a
single
year
as
it
chases
market
leader
Nvidia.
The
Information
had
reported
in
July
that
OpenAI
was
in
discussion
with
Broadcom
and
other
semiconductor
designers
about
developing
its
own
AI
chip,
and
earlier
this
year,
Bloomberg
reported
that
OpenAI
was
working
to
build
its
own
network
of
foundries,
but
according
to
Reuters,
those
plans
have
been
put
on
ice
due
to
cost
and
time.
The
reported
strategy
puts
OpenAI
on
a
similar
track
to
the
other
tech
companies
trying
to
manage
costs
and
access
to
AI
server
hardware
with
custom
chip
designs.
But
Google,
Microsoft,
and
Amazon
are
all
already
a
few
generations
down
the
road
in
their
efforts,
and
OpenAI
may
need
significantly
more
funding
to
become
a
true
competitor.
(Originally posted by Umar Shakir)
Comments